Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics | The International Journal of Advanced Manufacturing Technology
applied sciences
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
BW-CPS Gesamtprojekt Abschlussbericht
Peter WAPPLER | PhD | Master of Science | Institute for Micro Assembly Technology of the Hahn-Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies | Research profile
Medizintechnik und Gesundheit, Produktion und Industrie 4.0 sowie neueste Technologietrends | WOTech Technical Media | WOMag | WOClean
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
9 Gründe für den Einsatz eines inline Düsen-Viskosimeters... - Innonet Kunststoff
Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics | The International Journal of Advanced Manufacturing Technology
BW-CPS Gesamtprojekt Abschlussbericht
Peter Wappler - Wissenschaftlicher Mitarbeiter - Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | XING
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding - Document - Gale Academic OneFile
Peter WAPPLER | PhD | Master of Science | Institute for Micro Assembly Technology of the Hahn-Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies | Research profile
JMMP | Free Full-Text | An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
Marcel ROEDER | PhD Student | Doctor of Engineering | Hahn-Schickard, Stuttgart | Research profile
Peter WAPPLER | PhD | Master of Science | Institute for Micro Assembly Technology of the Hahn-Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies | Research profile
JMMP | Free Full-Text | Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
Herr Univ.-Prof. Dr.-Ing. André Zimmermann | Institut für Mikrointegration | Universität Stuttgart
Virtueller Stammtisch: KI-ready – Schritt für Schritt zur digitalisierten Produktion Mittelstand-Digital Zentrum Fokus Mensch
Romit K. on LinkedIn: Hahn-Schickard has a poster at the DLRK 2023 today. Do visit us and we…
9 Gründe für den Einsatz eines inline Düsen-Viskosimeters... - Innonet Kunststoff
Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics | The International Journal of Advanced Manufacturing Technology
Substitution metallischer Gehäuse
Peter WAPPLER | PhD | Master of Science | Institute for Micro Assembly Technology of the Hahn-Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies | Research profile
An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
Peter Wappler - Wissenschaftlicher Mitarbeiter - Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | XING
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding - Document - Gale Academic OneFile